| 器件图 |
型号/料号 |
品牌/制造商 |
类目 |
参数 |
说明 |
 |
804090 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Star Board (1-up), TCLAD LED IMS Series, IDH 2188494 |
 |
803261 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Avago Moonstone; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Avago Moonstone Emitter, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2180568 |
 |
804087 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram OSLON; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Oslon, Star Board (1-up), TCLAD LED IMS Series, IDH 2188493 |
 |
803128 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Star Board (1-up), TCLAD LED IMS Series, IDH 2188432 |
 |
804450 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Cree MX-6; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp MX-6, Star Board (1-up), TCLAD LED IMS Series, 804450-A |
|
804936 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XM-L; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree X-ML, TCLAD LED IMS Series, IDH 2188554 |
 |
803291 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Nichia Power LED 6.5 x 5; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Power LED 3.5 x 3.5, Star Board (1-up), TCLAD LED IMS Series, IDH 2188448 |
 |
804155 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Nichia Rigel 3.5 x 3.5; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Rigel 3.5 x 3.5, Star Board (1-up), TCLAD LED IMS Series, IDH 2188501 |
 |
804511 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-G; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-G, Star Board (1-up), TCLAD LED IMS Series, IDH 2180575 |
|
805245 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree MT-G; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree MTG, Star Board (1-up), TCLAD LED IMS Series, 805245-A |
 |
LZ4-4MCPCB |
LED Engin |
热基质 - MCPCB |
宽度 – 毫米:19.9 mm; 商标名:LuxiGen; 子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 长度 – 毫米:19.9 mm; 高度 – 毫米:1.7 mm; 商标:LED Engin; 宽度:19.9 mm; 系列:LZ4; 长度:19.9 mm; 高度:1.7 mm; 设计目的:10W Emitter; 配置:Star Board; RoHS:Y; 制造商:LED Engin; |
热基质 - MCPCB Metal Core PCB For LZ4 Series 1-CH |
 |
LZ1-1MCPCB |
LED Engin |
热基质 - MCPCB |
商标名:LuxiGen; 子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 商标:LED Engin; 系列:LZ1; 设计目的:3W / 5W Emitter; 配置:Star Board; RoHS:Y; 制造商:LED Engin; |
热基质 - MCPCB Metal Core PCB For LZ1 Series |
 |
804092 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Square Strip (17-up), TCLAD LED IMS Series, IDH 2188496 |
|
803288 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Square Strip (17-up), TCLAD LED IMS Series |
 |
803268 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2165657 |
 |
803265 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Luxeon I III & V; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon I, III and V, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188442 |
 |
803269 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Seoul P4; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2213562 |
 |
803808 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Osram OSTAR SMT; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Ostar SMT, Star Board (1-up), TCLAD LED IMS Series, IDH 2188479 |
 |
803122 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Cree XR-E; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp , Star Board (1-up), TCLAD LED IMS Series, 803122-A |
 |
803127 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Luxeon Rebel; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon Rebel, Star Board (1-up), TCLAD LED IMS Series, IDH 2188431 |
 |
803262 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Cree XR-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp , Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188440 |
 |
803267 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Luxeon Rebel; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon Rebel, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188443 |
 |
803129 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Seoul P4; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power, Star Board (1-up), TCLAD LED IMS Series |
 |
803123 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Lite-On LOPL; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lite-On LOPL, Star Board (1-up), TCLAD LED IMS Series |
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803790 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree MC-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp MC-E, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2165660 |
 |
803121 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:3971; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Avago Moonstone; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Avago Moonstone Emitter, Star Board (1-up), TCLAD LED IMS Series, IDH 2188427 |
|
804091 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188495 |
 |
804068 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Samsung Sunnix; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Star Board (1-up), TCLAD LED IMS Series, 804068-A |
|
803293 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Nichia Power LED 6.5 x 5; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Power LED 3.5 x 3.5, Square Strip (17-up), TCLAD LED IMS Series |
|
803263 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Lite-On LOPL; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lite-On LOPL, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series |
 |
803124 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Lumex SML LX; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumex SML-LX, Star Board (1-up), TCLAD LED IMS Series, 803124-A |
|
803282 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XR-E; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp , Square Strip (17-up), TCLAD LED IMS Series, 803282-A |
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803772 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree MC-E; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp MC-E, Star Board (1-up), TCLAD LED IMS Series, 803772-A |
|
803287 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Luxeon Rebel; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon Rebel, Square Strip (17-up), TCLAD LED IMS Series, IDH 2213563 |
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803805 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Seoul P7; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power P7, Square Strip (17-up), TCLAD LED IMS Series |
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803289 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Seoul P4; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power, Square Strip (17-up), TCLAD LED IMS Series |
 |
LDKFED-120C1WS4-01 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB LED MCPCB Down 6 120 '3014' LEDs |
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LEDFED-182C1WS4-01 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB LED MCPCB Down 6 182 '3014' LEDs |
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LZ4-2MCPCB |
LED Engin |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 商标:LED Engin; 封装:Bulk; RoHS:Y; 制造商:LED Engin; |
热基质 - MCPCB MCPCB Board for LZ4 series |
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LDKPCR-01C3BS4-03 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPCR; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /20.0x1.6mm 1S Cree XP |
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LDKPED-12L3BS4-11 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:700; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /300x40x1.6mm Edsn 1LA5 Seoul P4 |
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LDKPED-03C3BS4-01 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1500; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /46.5x1.6mm Edsn 1LA5 |
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LDKPED-04L3BS4-12 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1500; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /50x50x1.6mm Edsn 1LA5 Seoul P4 |
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LDKPED-04C3BS4-12 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1500; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /52x1.6mm 4S Edsn 1LA5 Seoul P4 |
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LDKPED-04L3BS4-02 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1500; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /110x25x1.6mm Edsn 1LA5 Seoul P4 |
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LDKPED-06C3BS4-05 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1000; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /70x2mm 6S Edsn 1LA5 Seoul P4 |
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LDKPED-06L3BS4-03 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:1200; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /160x25x2mm 6S Edsn 1LA5 Seoul P4 |
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LDKPED-18C5BR4-02 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /108x2mm 18S Edsn 1LA5 Seoul P4 |
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LDKPED-09C5BS4-03 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:700; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /90x2mm 9S Edsn 1LA5 Seoul P4 |
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LDKPED-09C5BS4-07 |
LedLink Optics |
热基质 - MCPCB |
子类别:Thermal Management; 标准包装数量:700; 产品类型:MCPCB - Thermal Substrates; 商标:LedLink Optics; 系列:LDKPED; 封装:Bulk; RoHS:Y; 制造商:LedLink Optics; |
热基质 - MCPCB MCPCB /95x2mm 9S Edsn 1LA5 Seoul P4 |
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