| 器件图 | 型号/料号 | 品牌/制造商 | 类目 | 参数 | 说明 | 
                
                
                    |  | conga-SEVAL | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V to 24 V; 最小工作温度:- 40 C; 最大工作温度:+ 85 C; 接口类型:CAN, GPIO, I2C, I2S, PCIe, SATA, SDIO, SPI, RS-232, USB; 商标:congatec; 外观尺寸:SMARC; 尺寸:294 mm x 172 mm; 工具用于评估:SMARC 2.0; 核心:Intel Atom, Intel Celeron, Intel Pentium; 产品:Carrier Boards; 系列:conga-SA5; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Evaluation carrier coard for SMARC 2.0 modules. | 
                
                
                    |  | IT6/COMe Carrier | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 商标:congatec; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Standard Mini-ITX carrier board for COM Express Type 6 modules. | 
                
                
                    |  | conga-MEVAL | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 商标:congatec; 封装:Bulk; 工具用于评估:COM Express Type 10; 核心:Intel Atom, Celeron; 产品:Carrier Boards; 系列:conga-MA3; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 EVALUATION CARRIER BRD COM EXP TYPE 10 | 
                
                
                    |  | conga-QEVAL/Qseven 2.0 | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 商标:congatec; 工具用于评估:Qseven 2.0; 核心:Intel Atom, Celeron, Pentium; 产品:Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0 | 
                
                
                    |  | 020735 | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - ARM; 商标:congatec; 产品:Carrier Boards; 制造商:congatec; | 开发板和工具包 - ARM MCB/Qseven ARM | 
                
                
                    |  | conga-QEVAL/Qseven 2.0 QKIT/ARM | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - ARM; 工作电源电压:12 V; 商标:congatec; 工具用于评估:Qseven; 核心:ARM Cortex A9; 产品:Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板和工具包 - ARM EVAL BOARD Q7 2.0 for conga-QMX6 | 
                
                
                    |  | conga-QKIT | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 用于:Qseven Modules; 接口类型:CAN, Ethernet, I2C, PCI, SATA, USB; 商标:congatec; 外观尺寸:Qseven; 描述/功能:Starter kit for Qseven including conga-QEVAL (007001), conga-LDVI/EPI (011115), conga-FPA1 (024241), Single DVI-D ADD2 Card 058500, ATX-power-supply; 工具用于评估:Qseven Modules; 核心:Intel Atom; 产品:Starter Kits; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 QSEVEN STARTER KIT Q7 1.0 EVAL BRD | 
                
                
                    |  | X7EVAL/ind | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 最小工作温度:- 40 C; 最大工作温度:+ 85 C; 商标:congatec; 尺寸:294 mm x 244 mm; 工具用于评估:congatec COM Express Type 7; 产品:Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Commercial temperature range from -40 C to 85 C. | 
                
                
                    |  | 065420 | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 商标:congatec; 制造商:congatec; | 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C. | 
                
                
                    |  | conga-MCB/COM Express | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 商标:congatec; 尺寸:95 mm x 145 mm; 工具用于评估:COM Express Type 2; 核心:AMD Ontario, Intel Atom, Celeron, Core i3/i5/i7; 产品:Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Mini Carrier Board for COM Express Compact Type2 modules with smart battery manager interface for mobile applications and SDVO display interface support for Intel mobile platforms. | 
                
                
                    |  | conga-ACC/I2S | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - ARM; 商标:congatec; RoHS:Y; 制造商:congatec; | 开发板和工具包 - ARM Audio card adapter with I2S codec for I2S/AC97 card edge connector to support Qseven ARM based modules. | 
                
                
                    |  | conga-X7/EVAL | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 商标:congatec; 尺寸:294 mm x 244 mm; 工具用于评估:COM Express Type 7; 核心:Intel Pentium D, Intel Xeon D; 产品:Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. The carrier features an Aspeed AST2500 Board Management Controller (BMC). Commercial temperature range from 0 C to 60 C. | 
                
                
                    |  | conga-X7EVAL/ind | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 最小工作温度:- 40 C; 最大工作温度:+ 85 C; 接口类型:I2C, PCIe, USB; 商标:congatec; 尺寸:294 mm x 244 mm; 工具用于评估:COM Express Type 7; 产品:Evaluation Boards; 制造商:congatec; | 开发板与工具包 - x86 Evaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Industrial temperature range from -40 C to 85 C. | 
                
                
                    |  | conga-Qseven Mobility Kit | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 产品类型:Development Boards & Kits - x86; 工作电源电压:19 V; 用于:Qseven Modules; 接口类型:LAN, HDMI, SATA, USB; 商标:congatec; 外观尺寸:Qseven; 描述/功能:Complete ready-to-use starter kit for mobile applications; 工具用于评估:Qseven Modules; 核心:Intel Atom; 产品:Starter Kits; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 QSEVEN STARTER KIT FOR MOBILE APPS | 
                
                
                    |  | conga-QKIT/ARM | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - ARM; 用于:Qseven; 商标:congatec; 描述/功能:Starter kit for Qseven evaluation carrier boards; 封装:Bulk; 工具用于评估:Qseven; 核心:ARM Cortex A9; 产品:Starter Kits; 系列:Qseven; RoHS:Y; 制造商:congatec; | 开发板和工具包 - ARM QSEVEN REFERENCE STARTER KIT | 
                
                
                    |  | 20710 | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 产品类型:Development Boards & Kits - x86; 工作电源电压:12 V; 最小工作温度:0 C; 最大工作温度:+ 60 C; 用于:XTX Modules; 接口类型:Ethernet, PCI, RS-232, USB; 商标:congatec; 外观尺寸:XTX; 尺寸:170 mm x 170 mm; 描述/功能:Carrier board for XTX-modules, Formfactor mini-ITX; 工具用于评估:XTX Modules; 核心:AMD Ontario, Intel Celeron, Intel Core Duo; 产品:Mini ITX Carrier Boards; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 Qseven Mini Carrier Board | 
                
                
                    |  | ACA2 | congatec | 嵌入式处理器开发套件 | 子类别:Development Tools; 标准包装数量:1; 产品类型:Development Boards & Kits - x86; 接口类型:CSI; 商标:congatec; 外观尺寸:SMARC; 工具用于评估:conga-SA5; 产品:Evaluation Modules; 系列:conga-SA5; RoHS:Y; 制造商:congatec; | 开发板与工具包 - x86 MIPI CSI 2.0 dual camera module for evaluation with SGET standard flat foil interface. |