| 器件图 |
型号/料号 |
品牌/制造商 |
类目 |
参数 |
说明 |
 |
PICOHEATSINKKIT |
TechNexion |
散热片 |
子类别:Heat Sinks; 标准包装数量:1; 产品类型:Heat Sinks; 商标:TechNexion; 产品:Heat Sinks; RoHS:Y; 制造商:TechNexion; |
散热片 PICO HEATSINK + THERMAL PAD + SCREWS + SPACERS + NUTS |
 |
PICOHS12M2T2020075KIT |
TechNexion |
散热片 |
子类别:Heat Sinks; 标准包装数量:1; 产品类型:Heat Sinks; 商标:TechNexion; 散热片样式:Straight Fin; 安装风格:Screw; 设计目的:i.MX6 Quad, i.MX8M; 产品:Heat Sinks; RoHS:Y; 制造商:TechNexion; |
散热片 PICO HEATSINK + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 QUAD LIDDED OR I.MX8M |
 |
EDMHS12M2T2020125KIT |
TechNexion |
散热片 |
子类别:Heat Sinks; 标准包装数量:1; 产品类型:Heat Sinks; 商标:TechNexion; 散热片样式:Straight Fin; 安装风格:Screw; 设计目的:EDM i.MX 6Solo/Duallite; 产品:Heat Sinks; RoHS:Y; 制造商:TechNexion; |
散热片 EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE + MYLAR |
 |
EDMHSCP12200501 |
TechNexion |
散热片 |
子类别:Heat Sinks; 标准包装数量:1; 产品类型:Heat Sinks; 商标:TechNexion; 宽度:12 mm; 长度:12 mm; 安装风格:Screw; 设计目的:Lidded Freescale CPUs; 产品:Heat Sinks; RoHS:Y; 制造商:TechNexion; |
散热片 EDM COMPACT 12mm PASS HEATSINK |
 |
EDMHSCP12201001 |
TechNexion |
散热片 |
子类别:Heat Sinks; 标准包装数量:1; 产品类型:Heat Sinks; 商标:TechNexion; 高度:1 mm; 宽度:20 mm; 长度:20 mm; 安装风格:Screw; 设计目的:MAPBGA, CPUS + MYLAR; 产品:Heat Sinks; RoHS:Y; 制造商:TechNexion; |
散热片 EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR |
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